PCB Printing Machines
Order Code: 22235427.36
Category: General Lab Equipment I
Printing Specifications: Minimum Trace Width: 0.2 mm Minimum Passive Size: 1005 Minimum Pin-to-Pin Pitch (Conductive Ink): 0.8 mml Minimum Pin-to-Pin Pitch (Solder Paste): 0.5 mml Resistivity: 12 m/sq @ 70 um Height Substrate Material...
SPECIFICATION
Printing Specifications:
- Minimum Trace Width: 0.2 mm
- Minimum Passive Size: 1005
- Minimum Pin-to-Pin Pitch (Conductive Ink): 0.8 mml
- Minimum Pin-to-Pin Pitch (Solder Paste): 0.5 mml
- Resistivity: 12 m/sq @ 70 um Height
- Substrate Material: FR4
- Maximum Board Thickness: 3 mm
Soldering Specifications:
- Solder Paste: Alloy
- Sn42/Bi57.6/Ag0.4
- Solder Wire: Alloy
- SnBiAg1
- Soldering Iron Temperature: 180-210°C
Computing Requirements:
- Compatible Operating Systems: Windows 7 or Higher
- Compatible File Format: Gerber
- Connection Type: Wired USB
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Tesca specialize in doing turnkey projects that is fully operable when it is handed over to the project authority. Starting from inception to application training, Tesca provides the services as ONE source solution. Working side by side with government authorities and people across the World, we help countries to perform better. We support countries grow their economies, strengthen their education and health systems and improve financial management. We do this by providing consultancy & training in environment safety, education, health strengthening.
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