SYSTEM ACCESSORIES AND CHASSIS
SPECIFICATION
i. Mounting Infrastructure: high-durability printed mounting panel (PIC Panel) for secure attachment
of all modules.
ii. Interconnect Cables: provision of at least five (5) high-density data cables (e.g., ribbon or D-sub)
to facilitate communication between the main microcontroller board and expansion ports.
iii. Connectivity Suite: provision of all necessary Micro USB leads and a minimum
of 6 Dupont-style jumper wires for inter-module connection.
iv. Storage: integrated 62mm depth daughter tray for organized component and cable management.
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Tesca specialize in doing turnkey projects that is fully operable when it is handed over to the project authority. Starting from inception to application training, Tesca provides the services as ONE source solution. Working side by side with government authorities and people across the World, we help countries to perform better. We support countries grow their economies, strengthen their education and health systems and improve financial management. We do this by providing consultancy & training in environment safety, education, health strengthening.
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